Japanease
English
- The Features of SDI Dip Coaters
- WHAT IS THE DIP COATER?
- About Fine Particles Array
- Summary of the Dip Coating System
Summary of the Dip Coating System
Process by the Dipping Method
It is the method of keeping a specimen vertically and dipping it into set Dip Coating Liquid, then raising-up from the liquid to upper portion and gelling of the attached liquid film in air (vapor phase).
1.Dip
2.Raising-up
3.Coating
4.Thin Film Formation & Dryness
 |
Dipping a specimen into Dip Coating Liquid tub perpendicularly |
|
Starting of raising-up with using mutual interaction of Viscous of Dip Coating Liquid, Surface Tension and Gravity. |
|
The Raising-up Speed of specimens controls the thickness of the film, from relationship with the viscosity of the Dip Coating Liquid and the Gravity which flows down adhered liquid. |
|
Completed to form uniformed thin film -- Dryness |
Relations of Raising-up Speed and the Film thickness
It will control the film thickness by Raising-up Speed and the Solvent Consistency.
The slower speed of Raising-up will make the thinner Film,
The higher speed of Raising-up will make the thicker Film.
The slower speed of Raising-up will make the thinner Film,
The higher speed of Raising-up will make the thicker Film.
Reference Data of Base Material Board Raising-up speed and Film Thickness
<1> Example of the Dip Coating for Glass Material Board dipping into the Solution of Titanium Oxide
Precursor NDH-510C (NISSO)
* Source of Reference: Manufacture of the titanium oxide film used with Micro Dip Coater MD-0408-S2
Institute of Industrial Science, the University of Tokyo
Nobuyuki Sakai,Tetsu Tatsuma
Institute of Industrial Science, the University of Tokyo
Nobuyuki Sakai,Tetsu Tatsuma
<2> Example of the Film Thickness Distribution when Dip Coating of Photo-resist to Copper sheet
[The Raising-up Speed of Base Material Board Detail]
Points for the Film Thickness Measurement
[Reference Data of the Film Thickness]
[The Raising-up Speed of Base Material Board Detail]
Points for the Film Thickness Measurement
<-Chuck Space for Base Material Board 4mm
{Raising-up Speed of Base Material Board : 15mm/sec..}
The Thickness of Base Material Board : t = 0.1 mm and 1.0 mm
Dimension of the Base Material Board : 510 mm x 510 mm
Measuring every 100 mm from A to F
Regarding at A & F, each 3 points every 5 mm were measured.
{Raising-up Speed of Base Material Board : 15mm/sec..}
The Thickness of Base Material Board : t = 0.1 mm and 1.0 mm
Dimension of the Base Material Board : 510 mm x 510 mm
Measuring every 100 mm from A to F
Regarding at A & F, each 3 points every 5 mm were measured.
[Reference Data of the Film Thickness]
| Thickness of Base Material Board | Measuring Point | ||||||||||
| A | B | C | D | E | F | ||||||
| 5mm | 10mm | 15mm | 5mm | 10mm | 15mm | ||||||
| Sample Board 0.1t 0.1t |
Surface | 9 | 9 | 9 | 11 | 11 | 11 | 11 | 11 | 10 | 10 |
| Reverse | 9 | 9 | 9 | 11 | 11 | 11 | 11 | 10 | 10 | 10 | |
| Sample Board 1.0t 1.0t |
Surface | 9 | 9 | 10 | 10 | 10 | 10 | 11 | 9 | 9 | 9 |
| Reverse | 9 | 9 | 9 | 11 | 11 | 11 | 11 | 10 | 10 | 10 | |
