WHAT IS THE DIP COATER (Dip Coating Equipment)?

It is the mechanism which forms a Thin Film by raising-up the specimen at low speed after dipping in the coating liquid.
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Summary of the Dip Coating System
Process by the Dipping Method
It is the method of keeping a specimen vertically and dipping it into set Dip Coating Liquid, then raising-up from the liquid to upper portion and gelling of the attached liquid film in air (vapor phase).
1.ディップ
1.Dip
2.引き上げ
2.Raising-up
3.コーティング
3.Coating
4.薄膜形成及び乾燥
4.Thin Film Formation & Dryness
Dipping a specimen into Dip Coating Liquid tub perpendicularly
Starting of raising-up with using mutual interaction of Viscous of Dip Coating Liquid, Surface Tension and Gravity.
The Raising-up Speed of specimens controls the thickness of the film, from relationship with the viscosity of the Dip Coating Liquid and the Gravity which flows down adhered liquid.
Completed to form uniformed thin film -- Dryness

Relations of Raising-up Speed and the Film thickness
Concerning with the thickness of the raw material film before the burning *1
The film thickness after burning [x] should be proportional to the thickness of the raw material film before the burning [h], therefore the Density of Coating Solutions [d] (Mass per unit area) and its Viscosity [η], also the Speed of Raising-up in the Dip Coating [u] are considered about as the affecting parameters of forming film. [a] is a Coefficient and [g] is the Acceleration of Gravity.
*1 Source of Reference: Latest Transparence Conductive Film Trend (2005)
It will control the film thickness by Raising-up Speed and the Solvent Consistency.
  • The slower speed of Raising-up will make the thinner Film,
  • The higher speed of Raising-up will make the thicker Film.



Reference Data of Base Material Board Raising-up speed and Film Thickness
<1> Example of the Dip Coating for Glass Material Board dipping into the Solution of Titanium Oxide Precursor NDH-510C (NISSO)

* Source of Reference: Manufacture of the titanium oxide film used with Micro Dip Coater MD-0408-S2
Institute of Industrial Science, the University of Tokyo
Nobuyuki Sakai,Tetsu Tatsuma

<2> Example of the Film Thickness Distribution when Dip Coating of Photo-resist to Copper sheet

[The Raising-up Speed of Base Material Board Detail]

Points for the Film Thickness Measurement
<-Chuck Space for Base Material Board 4mm

{Raising-up Speed of Base Material Board : 15mm/sec..}
The Thickness of Base Material Board : t = 0.1 mm and 1.0 mm
Dimension of the Base Material Board : 510 mm x 510 mm
Measuring every 100 mm from A to F
Regarding at A & F, each 3 points every 5 mm were measured.


[Reference Data of the Film Thickness]

Thickness of Base Material Board Measuring Point
A B C D E F
5mm 10mm 15mm 5mm 10mm 15mm
Sample Board 0.1t Surface 9 9 9 11 11 11 11 11 10 10
Reverse 9 9 9 11 11 11 11 10 10 10
Sample Board 1.0t Surface 9 9 10 10 10 10 11 9 9 9
Reverse 9 9 9 11 11 11 11 10 10 10

The Features of SDI Dip Coaters (Dip Coating Equipments) | What is the Dip Coating (Dip Coat)?
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